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original_kernel/drivers/thermal/samsung/Kconfig

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thermal: exynos: Moving exynos thermal files into samsung directory This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 18:50:22 +08:00
config EXYNOS_THERMAL
thermal: exynos: Bifurcate exynos thermal common and tmu controller code This code bifurcates exynos thermal implementation into common and sensor specific parts. The common thermal code interacts with core thermal layer and core cpufreq cooling parts and is independent of SOC specific driver. This change is needed to cleanly add support for new TMU sensors. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 18:50:25 +08:00
tristate "Exynos thermal management unit driver"
thermal: exynos: Use ARCH_HAS_BANDGAP config to know the supported soc's This patch uses the recently added config sybmol ARCH_HAS_BANDGAP to enable the TMU driver. This will allow adding support for new soc easily as now it is the platform responsibility to enable this config symbol for a particular soc. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 18:50:23 +08:00
depends on ARCH_HAS_BANDGAP
thermal: exynos: Moving exynos thermal files into samsung directory This movement of files is done for easy maintenance and adding more new sensor's support for exynos platform easily . This will also help in bifurcating exynos common, sensor driver and sensor data related parts. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 18:50:22 +08:00
help
thermal: exynos: Bifurcate exynos thermal common and tmu controller code This code bifurcates exynos thermal implementation into common and sensor specific parts. The common thermal code interacts with core thermal layer and core cpufreq cooling parts and is independent of SOC specific driver. This change is needed to cleanly add support for new TMU sensors. Acked-by: Kukjin Kim <kgene.kim@samsung.com> Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com> Acked-by: Eduardo Valentin <eduardo.valentin@ti.com> Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com> Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-06-24 18:50:25 +08:00
If you say yes here you get support for the TMU (Thermal Management
Unit) driver for SAMSUNG EXYNOS series of soc. This driver initialises
the TMU, reports temperature and handles cooling action if defined.
This driver uses the exynos core thermal API's.
config EXYNOS_THERMAL_CORE
bool "Core thermal framework support for EXYNOS SOC's"
depends on EXYNOS_THERMAL
help
If you say yes here you get support for EXYNOS TMU
(Thermal Management Unit) common registration/unregistration
functions to the core thermal layer and also to use the generic
cpu cooling API's.